Pin
Connections
| Port |
Primary
Dot |
Primary |
Primary
CT |
Second-
ary Dot |
Second-
ary |
Second-
ary CT |
Gnd
Ext. |
Case
Gnd |
Not
Used |
| gs |
6 |
4 |
- |
3 |
1 |
2 |
- |
- |
5 | |
Case Style - TT240
(inch,mm ) weight: 0.5 grams.
| A |
B |
C |
D |
E |
F |
G |
H |
J |
.250
6.350 |
.31
7.874 |
.20
5.080 |
.100
2.540 |
.050
1.270 |
.055
1.397 |
.040
1.016 |
.070
1.778 |
.270
6.858 |
| K |
L |
M |
N |
P |
Q |
R |
S |
T |
.050
1.270 |
|
|
|
|
|
|
|
| Tolerance: .x
± .1 .xx ± .03 .xxx ± .015
inch. | Material and Finish:
| |
Case material: ceramic.
Terminations: solder plate over nickel. Board edges
straight. | Packaging:
 Packaging
information:
Tape Width(mm): 16
Reel Size(inches): 13
Device
Cavity Pitch(mm): 12
Devices Per Reel: 500
|
Notes:
| • |
For Surface
Mount Environmental Specifications, please click here.
Re-flow
soldering information is available in "Surface
Mount" article. |
| • |
Maximum Ratings:
RF Power 250 mW |
| • |
Insertion loss
referenced to mid-band loss, 1.3 dB typ. |
| • |
Impedance ratio
= secondary (150 ohms)/primary(75 ohms) |
| • |
Phase Unbalance:
deviation from 180° |
| • |
General Quality
Control Procedures and Environmental Specifications are given in Mini-Circuits
Guarantees Quality.
Hi-Rel, MIL description are given in Hi-Rel and
MIL |
| • |
Prices and
Specifications subjects to change without
notice. |
FREQ.
(MHz) |
Insertion
Loss(dB) |
Input
Return
Loss(dB) |
| 20.000 |
1.49 |
14.44 |
| 40.000 |
1.27 |
18.74 |
| 100.000 |
1.24 |
24.19 |
| 200.000 |
1.60 |
25.31 |
| 300.000 |
1.55 |
21.89 |
| 500.000 |
1.33 |
19.19 |
| 600.000 |
1.29 |
18.76 |
| 800.000 |
1.48 |
19.33 |
| 1000.000 |
1.68 |
20.40 |
| 1100.000 |
1.66 |
17.94 | | |
Configuration Type:
