RAM-3
Frequency
MHz		 GAIN, dB Maximum Power, dBm Dynamic Range VSWR Absolute
Maximum
Rating		 DC Power Thermal
resistance
Øjc
°C/W
fL - fU Min. Output
(1 dB
Comp.)		 Input
(no
damage)		 NF
dB
Typ.		 IP3
dBm
Typ.		 In
Typ.		 Out
Typ.		 I
(mA)		 P
(mW)		 Cur-
rent
(mA)		 Volt(V.)
DC-2000 8.00 +10.00 +13.00 6.00 23.00 1.60 1.70 80.00 425.00 35.00 5.00 150.00
Lw=low range(fL to fU/2)  U=upper range(fU/2 to fU)

Pin Connections
Port RF in RF Out DC Case GND Not Used
cb 1 3 3 2,4 -



Case Style - AF190 (inch,mm )   weight: 0.04 grams.
A B C D E F G H J
.180
4.572		 .090
2.286		 .020
0.508		 .100
2.540		 .083
2.108		 .076
1.930		 .005
0.127		 .022
0.559		 .210
5.334
K L M N P Q R S T
.060
1.524		 .060
1.524		 .060
1.524		 .020
0.508		          
Tolerance: .x ± .1  .xx ± .03  .xxx ± .015 inch.
Material and Finish:
    Case material: ceramic. Lead material: #42 alloy. Finish: tin-lead plate.
Marking:
    RF input lead (1) identified by diagonally cut lead.
Special Tolerances:
    Lead width ±.005; lead thickness ±.002; cap diameter ±.005 inch.
Packaging:

Packaging information:
Tape Width(mm): 12
Reel Size(inches): 7
Device Cavity Pitch(mm): 8
Devices Per Reel: 500,1000

 Notes:
• Minimum gain at highest frequency. Full temperature range, except room temperature for Dash-4 models.
• Frequency at which output power, NF and IP3 are specified: 1000 MHz.
• Thermal resistance Øjc is from hottest junction in the device to the mounting surface of the leads.
• Model number designated by alphanumeric code marking.
• Permanent damage may occur if any of these limits are exceeded. These ratings are not intended for continuous normal operation.
• For Amplifier Selection Guide, please click here.
For Amplifier Environmental Specifications, please click here.
• For Surface Mount Environmental Specifications, please click here.
Re-flow soldering information is available in "Surface Mount" article.
• Low frequency cutoff determined by external coupling capacitors.
• RAM models are hermetically sealed.
• Non-hermetic
• Typical Biasing Configuration ERA/MAR/MAV/RAM/VAM
• Prefix letter (optional) designates assembly location.
• Reliability predictions and normal operation conditions are applicable at current specified.
• General Quality Control Procedures and Environmental Specifications are given in Mini-Circuits Guarantees Quality.
Hi-Rel, MIL description are given in Hi-Rel and MIL
• Prices and Specifications subjects to change without notice.

FREQ
(MHz)		 S11 (Input Return Loss) S21 (Power Gain) S12 (Isolation Out-in) S22 (Output Return Loss)
dB Mag Ang dB Ang dB Mag Ang dB Mag Ang
100.00 -23.10 0.07 172.00 13.00 174.00 -18.42 0.12 1.00 -16.48 0.15 -11.00
500.00 -24.44 0.06 156.00 12.80 152.00 -18.42 0.12 5.00 -15.92 0.16 -45.00
1000.00 -26.02 0.50 146.00 12.50 128.00 -17.72 0.13 10.00 -14.98 0.18 -88.00
1500.00 -27.96 0.40 172.00 11.80 103.00 -17.08 0.14 12.00 -13.56 0.21 -120.00
2000.00 -24.44 0.06 173.00 10.50 83.00 -14.98 0.18 11.00 -12.04 0.25 -142.00
2500.00 -15.39 0.17 175.00 10.30 59.00 -14.42 0.19 5.00 -11.70 0.26 -173.00
3000.00 -12.40 0.24 157.00 9.10 38.00 -13.98 0.20 0.00 -12.04 0.25 168.00
3500.00 -9.90 0.32 140.00 7.80 21.00 -13.56 0.21 -6.00 -12.04 0.25 152.00
4000.00 -8.18 0.39 124.00 6.50 3.00 -13.15 0.22 -14.00 -12.04 0.25 138.00