RAM-1
Frequency
MHz		 GAIN, dB Maximum Power, dBm Dynamic Range VSWR Absolute
Maximum
Rating		 DC Power Thermal
resistance
Øjc
°C/W
fL - fU Min. Output
(1 dB
Comp.)		 Input
(no
damage)		 NF
dB
Typ.		 IP3
dBm
Typ.		 In
Typ.		 Out
Typ.		 I
(mA)		 P
(mW)		 Cur-
rent
(mA)		 Volt(V.)
DC-1000 13.00 +1.50 +13.00 5.50 14.00 1.30 1.30 40.00 200.00 17.00 5.00 150.00
Lw=low range(fL to fU/2)  U=upper range(fU/2 to fU)

Pin Connections
Port RF in RF Out DC Case GND Not Used
cb 1 3 3 2,4 -



Case Style - AF190 (inch,mm )   weight: 0.04 grams.
A B C D E F G H J
.180
4.572		 .090
2.286		 .020
0.508		 .100
2.540		 .083
2.108		 .076
1.930		 .005
0.127		 .022
0.559		 .210
5.334
K L M N P Q R S T
.060
1.524		 .060
1.524		 .060
1.524		 .020
0.508		          
Tolerance: .x ± .1  .xx ± .03  .xxx ± .015 inch.
Material and Finish:
    Case material: ceramic. Lead material: #42 alloy. Finish: tin-lead plate.
Marking:
    RF input lead (1) identified by diagonally cut lead.
Special Tolerances:
    Lead width ±.005; lead thickness ±.002; cap diameter ±.005 inch.
Packaging:

Packaging information:
Tape Width(mm): 12
Reel Size(inches): 7
Device Cavity Pitch(mm): 8
Devices Per Reel: 500,1000

 Notes:
• Minimum gain at highest frequency. Full temperature range, except room temperature for Dash-4 models.
• Thermal resistance Øjc is from hottest junction in the device to the mounting surface of the leads.
• Model number designated by alphanumeric code marking.
• Permanent damage may occur if any of these limits are exceeded. These ratings are not intended for continuous normal operation.
• For Amplifier Selection Guide, please click here.
For Amplifier Environmental Specifications, please click here.
• For Surface Mount Environmental Specifications, please click here.
Re-flow soldering information is available in "Surface Mount" article.
• Low frequency cutoff determined by external coupling capacitors.
• RAM models are hermetically sealed.
• Frequency at which output power, NF and IP3 are specified: 500 MHz.
• Non-hermetic
• Typical Biasing Configuration ERA/MAR/MAV/RAM/VAM
• Prefix letter (optional) designates assembly location.
• Reliability predictions and normal operation conditions are applicable at current specified.
• General Quality Control Procedures and Environmental Specifications are given in Mini-Circuits Guarantees Quality.
Hi-Rel, MIL description are given in Hi-Rel and MIL
• Prices and Specifications subjects to change without notice.

FREQ
(MHz)		 S11 (Input Return Loss) S21 (Power Gain) S12 (Isolation Out-in) S22 (Output Return Loss)
dB Mag Ang dB Ang dB Mag Ang dB Mag Ang
100.00 -23.10 0.07 164.00 18.50 171.00 -21.94 0.08 4.00 -23.10 0.07 -14.00
500.00 -24.44 0.06 106.00 17.50 141.00 -21.94 0.08 15.00 -23.10 0.07 -68.00
1000.00 -24.44 0.06 72.00 15.50 111.00 -20.00 0.10 24.00 -20.92 0.09 -124.00
1500.00 -27.96 0.04 59.00 13.70 87.00 -17.72 0.13 26.00 -20.00 0.14 -161.00
2000.00 -24.44 0.06 149.00 12.30 67.00 -15.92 0.16 21.00 -15.92 0.16 -177.00
2500.00 -20.00 0.10 142.00 10.60 49.00 -14.89 0.18 18.00 -15.92 0.16 155.00
3000.00 -18.42 0.12 139.00 9.30 34.00 -13.98 0.20 12.00 -16.48 0.15 144.00
3500.00 -13.97 0.20 129.00 7.90 19.00 -13.15 0.22 5.00 -15.92 0.16 135.00
4000.00 -11.06 0.28 120.00 6.60 3.00 -12.04 0.25 -4.00 -15.39 0.17 127.00