RAM-8
Frequency
MHz
GAIN, dB Maximum Power, dBm Dynamic Range Absolute
Maximum
Rating
DC Power Thermal
resistance
Øjc
°C/W
fL - fU Min. Output
(1 dB
Comp.)
Input
(no
damage)
NF
dB
Typ.
IP3
dBm
Typ.
I
(mA)
P
(mW)
Cur-
rent
(mA)
Volt(V.)
DC-1000 19.00 +12.50 +13.00 3.00 27.00 65.00 420.00 36.00 7.80 175.00
Lw=low range(fL to fU/2)  U=upper range(fU/2 to fU)

Pin Connections
Port RF in RF Out DC Case GND Not Used
cb 1 3 3 2,4 -



Case Style - AF190 (inch,mm )   weight: 0.04 grams.
A B C D E F G H J
.180
4.572
.090
2.286
.020
0.508
.100
2.540
.083
2.108
.076
1.930
.005
0.127
.022
0.559
.210
5.334
K L M N P Q R S T
.060
1.524
.060
1.524
.060
1.524
.020
0.508
         
Tolerance: .x ± .1  .xx ± .03  .xxx ± .015 inch.
Material and Finish:
    Case material: ceramic. Lead material: #42 alloy. Finish: tin-lead plate.
Marking:
    RF input lead (1) identified by diagonally cut lead.
Special Tolerances:
    Lead width ±.005; lead thickness ±.002; cap diameter ±.005 inch.
Packaging:

Packaging information:
Tape Width(mm): 12
Reel Size(inches): 7
Device Cavity Pitch(mm): 8
Devices Per Reel: 500,1000

Notes:
• Minimum gain at highest frequency. Full temperature range, except room temperature for Dash-4 models.
• Frequency at which output power, NF and IP3 are specified: 1000 MHz.
• Thermal resistance Øjc is from hottest junction in the device to the mounting surface of the leads.
• Model number designated by alphanumeric code marking.
• Permanent damage may occur if any of these limits are exceeded. These ratings are not intended for continuous normal operation.
• For Amplifier Selection Guide, please click here.
For Amplifier Environmental Specifications, please click here.
• For Surface Mount Environmental Specifications, please click here.
Re-flow soldering information is available in "Surface Mount" article.
• Low frequency cutoff determined by external coupling capacitors.
• RAM models are hermetically sealed.
• Input and output impedances are not 50 ohms, see S-parameter data. Conditionally stable, source and load VSWR<3:1 required.
• Non-hermetic
• Typical Biasing Configuration ERA/MAR/MAV/RAM/VAM
• Prefix letter (optional) designates assembly location.
• Reliability predictions and normal operation conditions are applicable at current specified.
• General Quality Control Procedures and Environmental Specifications are given in Mini-Circuits Guarantees Quality.
Hi-Rel, MIL description are given in Hi-Rel and MIL
• Prices and Specifications subjects to change without notice.

FREQ
(MHz)
S11 (Input Return Loss) S21 (Power Gain) S12 (Isolation Out-in) S22 (Output Return Loss)
dB Mag Ang dB Ang dB Mag Ang dB Mag Ang
100.00 -15.92 0.61 -21.00 33.00 162.00 -40.00 0.01 38.00 -4.73 0.58 -24.00
500.00 -8.18 0.39 -77.00 27.80 109.00 -27.96 0.04 52.00 -9.37 0.34 -96.00
1000.00 -11.37 0.27 -113.00 23.00 80.00 -24.44 0.06 51.00 -13.56 0.21 -147.00
1500.00 -11.70 0.26 -139.00 19.40 62.00 -21.94 0.08 46.00 -14.89 0.18 174.00
2000.00 -10.46 0.30 -155.00 16.90 47.00 -20.00 0.10 41.00 -15.39 0.17 153.00
2500.00 -9.63 0.33 -180.00 14.80 32.00 -18.42 0.12 32.00 -14.42 0.19 127.00
3000.00 -8.84 0.36 167.00 12.90 20.00 -17.72 0.13 27.00 -17.08 0.14 111.00
3500.00 -7.54 0.42 153.00 11.40 6.00 -17.08 0.14 21.00 -17.72 0.13 107.00
4000.00 -6.94 0.45 141.00 9.80 -5.00 -16.48 0.15 14.00 -19.17 0.11 106.00