RAM-6
Frequency
MHz
GAIN, dB Maximum Power, dBm Dynamic Range VSWR Absolute
Maximum
Rating
DC Power Thermal
resistance
Øjc
°C/W
fL - fU Min. Output
(1 dB
Comp.)
Input
(no
damage)
NF
dB
Typ.
IP3
dBm
Typ.
In
Typ.
Out
Typ.
I
(mA)
P
(mW)
Cur-
rent
(mA)
Volt(V.)
DC-2000 9.00 +2.00 +13.00 2.80 14.50 1.40 1.30 50.00 200.00 16.00 3.50 155.00
Lw=low range(fL to fU/2)  U=upper range(fU/2 to fU)

Pin Connections
Port RF in RF Out DC Case GND Not Used
cb 1 3 3 2,4 -



Case Style - AF190 (inch,mm )   weight: 0.04 grams.
A B C D E F G H J
.180
4.572
.090
2.286
.020
0.508
.100
2.540
.083
2.108
.076
1.930
.005
0.127
.022
0.559
.210
5.334
K L M N P Q R S T
.060
1.524
.060
1.524
.060
1.524
.020
0.508
         
Tolerance: .x ± .1  .xx ± .03  .xxx ± .015 inch.
Material and Finish:
    Case material: ceramic. Lead material: #42 alloy. Finish: tin-lead plate.
Marking:
    RF input lead (1) identified by diagonally cut lead.
Special Tolerances:
    Lead width ±.005; lead thickness ±.002; cap diameter ±.005 inch.
Packaging:

Packaging information:
Tape Width(mm): 12
Reel Size(inches): 7
Device Cavity Pitch(mm): 8
Devices Per Reel: 500,1000

Notes:
• Minimum gain at highest frequency. Full temperature range, except room temperature for Dash-4 models.
• Conditionally stable, source and load VSWR<5:1 required.
Potentially unstable with very high VSWR terminations.
• Thermal resistance Øjc is from hottest junction in the device to the mounting surface of the leads.
• Model number designated by alphanumeric code marking.
• Permanent damage may occur if any of these limits are exceeded. These ratings are not intended for continuous normal operation.
• For Amplifier Selection Guide, please click here.
For Amplifier Environmental Specifications, please click here.
• For Surface Mount Environmental Specifications, please click here.
Re-flow soldering information is available in "Surface Mount" article.
• Low frequency cutoff determined by external coupling capacitors.
• RAM models are hermetically sealed.
• Frequency at which output power, NF and IP3 are specified: 500 MHz.
• Non-hermetic
• Typical Biasing Configuration ERA/MAR/MAV/RAM/VAM
• Prefix letter (optional) designates assembly location.
• Reliability predictions and normal operation conditions are applicable at current specified.
• General Quality Control Procedures and Environmental Specifications are given in Mini-Circuits Guarantees Quality.
Hi-Rel, MIL description are given in Hi-Rel and MIL
• Prices and Specifications subjects to change without notice.

FREQ
(MHz)
S11 (Input Return Loss) S21 (Power Gain) S12 (Isolation Out-in) S22 (Output Return Loss)
dB Mag Ang dB Ang dB Mag Ang dB Mag Ang
100.00 -27.96 0.04 171.00 20.10 171.00 -22.50 0.75 5.00 -27.96 0.04 -30.00
500.00 -26.02 0.05 -105.00 18.70 138.00 -21.30 0.09 21.00 -20.00 0.10 -104.00
1000.00 -17.72 0.13 -118.00 16.40 107.00 -18.80 0.12 28.00 -17.08 0.14 -150.00
1500.00 -13.56 0.21 -140.00 14.10 84.00 -17.10 0.14 28.00 -16.48 0.15 180.00
2000.00 -10.75 0.29 -163.00 12.00 65.00 -15.80 0.16 26.00 -15.92 0.16 157.00
2500.00 -9.37 0.34 -176.00 10.30 55.00 -15.20 0.17 28.00 -15.92 0.16 150.00
3000.00 -7.74 0.41 169.00 8.70 42.00 -14.80 0.18 25.00 -16.48 0.15 143.00
3500.00 -6.74 0.46 157.00 7.20 30.00 -14.20 0.19 22.00 -17.72 0.13 144.00
4000.00 -6.20 0.49 146.00 6.10 18.00 -13.80 0.20 20.00 -20.00 0.10 156.00